Time：2019-12-02 Browse times：492second
Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning.
Production date: 2004
Rated power: ac200v, 50 / 60Hz, 21kwv
Compressed air: 0.5MPa 350l/mi
Grinding water: 0.2MPa 25L / min
L cooling water: 0.2MPa 9L / min
Weight: 5000kg
Equipment name:
Grinder thinning machine
Manufactor:
DISCO
Model:
DFG860
Particular year:
2004
Equipment status:
Working
