SS20

8-inch dicing machine

Small footprint with highly stable structure.

Compliant with the large work

Feature1

nFootprint

Small footprint with highly stable structure

nCompliant with large wafers

250mm square work size as a standard feature ※

nHigh-resolution microscope

Improved resolution

nUser Friendly

Improved operability with the 17-inch touch panel screen

※Max. work size □ 250mm

Feature2

nAccommodates various types of workpieces as standard option

①12-inch frame

②250 * 250mm workpiece

nStandard Spindles up to 60,000rpm

Option:High speed spindle 80,000rpm, High power spindle 2.2kW(30,000rpm)

nEnhanced throughput

X axis 800mm/sec, Y axis 300mm/sec, and Z axis 80mm/sec

n17” LCD touch panel and new GUI (Graphical User Interface) with simple layout and large touch-buttons allow users’ interactive operation

nEasy and simple Kerf check function

(AI kerf check function)

nStores over 10,000 recipes

nUSB port as standard option

(USB memory device can be used as external memory)

nEase-of-maintenance

Wide maintenance door and front-side accessibility allows easy routine maintenance

nOptimized vacuum controller

reduces 50% of air consumption compared with existing model

Feature3

nMaintenance

Large access area is secured.