Time：2019-12-05 Browse times：242second
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Equipment name: |
Vacuum sucker |
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Manufactor: |
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Model: |
20μm以下 |
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Particular year: |
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Equipment status: |
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The working table of bonding machine refers to the parts mainly used in semiconductor manufacturing stage and assembled on wire bond (wire bonding equipment), which is also the application product of porous sucker.
Up to now, it is generally carved into metal blades according to the chip shape, but with the chip size unification (CSP), the manufacturing process has also changed a lot.
With the adoption of wire bond process
Since the adsorption table, we have also achieved a variety of low-cost and efficient production.
The bonding table (bonding table) requires a very high flatness in high temperature environment.
Type of binding table:
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| A | B |
C |
Specifications of binding table:
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Flatness of adsorption surface |
Below 20 m |
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Body shape |
It can be processed according to chip and package shape. Even if there is no part drawing, as long as there are samples or simple concept drawings and specifications, we will draw and make finished products for delivery. |
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Body & porous material |
Porous materials have light and easy to operate ceramics, and metal materials with easy maintenance and high durability. The body is usually made of stainless steel. In addition, titanium material is also prepared, which is 30% lighter than stainless steel and 10% smaller in thermal deflection. It can minimize the deformation rate of worktable caused by temperature change. It is an ultra-high precision product. |
