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DFM2700+8760

Time：2020-02-11 Browse times：970second

Through the integrated on-line system, a more secure wafer thinning technology is realized
The equipment is a wafer applicator which pastes the φ 300 mm thin crystal figure on the cutting frame and then peels off the protective film on its surface. Through the on-line system composed of the back grinding machine and polishing machine (dgp8761, dfg8560, dfp8160), a series of manufacturing procedures can be safely and reliably operated from the thin type grinding and machining of Jingguo, then pasted on the cutting frame ↑ and finally peeled off the surface protective film, realizing the continuous automatic production. Because Coke needs to be handled manually, the wafer transfer between stock and reserve can be carried out more safely, which helps to improve the yield of thin processing technology.
Applicable to various DAF film technologies
With the increasing popularity of siip (system in package), the DAF (dieattach film) device necessary for the implementation of lamination in recent years is also built in this die. In the device, DAF is pre cut, then pasted on the wafer, and the protective film is peeled off. In this way, the super thin DAF below 25 um can be pasted. In addition, it is also suitable for cutting DAF film integrated with adhesive film. (the heating device of wafer mounting platform is specially selected)

Workflow system
Accept the work object sent from the back grinding overview letter, or ① "take the work object out of the star cluster box + @ carry the work object to the detection platform (any) and pack the surface retaining ring membrane for UV (press outside the case) shooting (when using the UVB membrane)
Positioning and calibration through image processing →
Paste DAF (dleattach film) onto the wafer one ⑥ finish the work of DAF pasting and apply secondary hardening one
Use the cutting button film to install the work object on the cutting frame → ⑧ peel off the surface protective film → ⑧ put it into the cutting frame
Pulp box
Rich special options
A variety of special parts are prepared for use, including a pre cutting device which can cut the uncut cutting adhesive film inside the equipment; In addition to the use of standard Shuwei adhesive film to peel off the surface protective adhesive film, there are also adhesive film peeling devices with adhesive film Baoshi: in addition, there is a bar code braid recognition system, which can batch the ID of the surface of the crystal diagram, print the alkali into purlin, and then paste it on the cutting glue after the wafer is pasted.
Save floor space
Dfm2700 replaces the manual handling system in the original brain computer system with a built-in general arm to transmit the crystal diagram among the equipment, and slows down the design of the internal terrorism of the equipment, thus greatly saving the equipment's floor space.
Can operate as an independent device
It can also be operated as a stand-alone device by using the usual crystal state storage box and DSC (double slot asetne8).

Chapter I：MES production management system

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