Time：2019-12-02 Browse times：817second
Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services.
Rated power: ac200v, 50 / 60Hz, 17kwv
Compressed air: 0.5MPa 300l/mi
Grinding water: 0.2MPa 15L / min
L cooling water: 0.2MPa 11L / min
Weight: 2300kg
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Equipment name: |
Slicer cutter |
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Manufactor: |
DISCO |
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Model: |
DAD2H6T |
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Particular year: |
1996 |
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Equipment status: |
Working |
