IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire Bonding today, PLUS tomorrow. To meet all leading edge wire bonding challenges, the IConn PLUS was designed with new capabilities and features in five key focus areas: ▪ Process Robustness ▪ Production Portability ▪ Ease of Use ▪ Robust Hardware Performance ▪ Upgradeability
