From semiconductor wafer to electronic parts, it can be processed in various ways It can be used for working objects with a maximum length of 6 inches and a width of 6 inches High precision index control can be achieved by using Y-axis scale (optional) With high torque 2.0kw spindle It can also be used to process glass, ceramics and other difficult cutting materials. In addition, high speed 1.8kw spindle can be selected (maximum rotation: 60000 min-1) as an option, it is a machine with high versatility.
