DFD6361

Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
Consistent cut quality
DFD6361 offers highly consistent and dependable cut quality through the new Synchro SpindleTM featuring superior radial rigidity. An atomizing nozzle cleaning mechanism can also be installed in the spinner unit as an option to effectively clean wafers after dicing (Patent no.3410385).