Product-第5页-Suzhou Superlight Microelectronics Co., Ltd.

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SSMC

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Used Equipments
- Back Grinder
  - DISCO
  - ACCRETECH
  - OKAMOTO
- Dicing Saw
- Die Bonder
  - ASM
  - SHINKAWA
  - Other
- Wire Bonder
  - K&S
  - ASM
  - SHINKAWA
- Testing equipment
- Molding equipment
- Peripheral equipment
Agent Equipments
- DIC
Spare Parts and Consumables
Test Equipments
Developing Equipments
- Wafer Mounter
- Cleaner
OEM Service
- Sawing/Grinding OEM
Equipment Software

Product Center

Used Equipments
- Back Grinder
  - DISCO
  - ACCRETECH
  - OKAMOTO
- Dicing Saw
- Die Bonder
  - ASM
  - SHINKAWA
  - Other
- Wire Bonder
  - K&S
  - ASM
  - SHINKAWA
- Testing equipment
- Molding equipment
- Peripheral equipment
Agent Equipments
- DIC
Spare Parts and Consumables
Test Equipments
Developing Equipments
- Wafer Mounter
- Cleaner
OEM Service
- Sawing/Grinding OEM
Equipment Software

6-inch cleaning plate

8-inch cleaning plate

6 "manual ceramic sucker

TSK 6 "cleaning plate

TSK 8 "cleaning plate

8 "manual ceramic sucker

Resin bond blade

Metal bond blade

Cutting film

PEELING membrane

P Series

C Series

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Address: No.8 workshop, no.225, Huajin Road, Tong'an Town, high tech Zone, Suzhou; tel.: + 86) 0512-6937-0370
Mobile: 18051228778 Fax: + 86) 0512-6937-0369 email: sales@ssmc.com.cn