时间：2019-12-05 浏览次数：961次
|
设备名称: |
Laser Dicing M/C |
|
厂家: |
ACCRETECH |
|
型号: |
ML300Plus ⅡWH |
|
年份: |
now |
|
设备状态: |
new |
12-inch laser dicing machine with wafer handling system.
We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.
