时间：2019-12-05 浏览次数：953次
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设备名称: |
Laser Dicing M/C |
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厂家: |
ACCRETECH |
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型号: |
ML300Plus ⅡWH |
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年份: |
now |
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设备状态: |
new |
12-inch laser dicing machine with wafer handling system.
We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.
