Time：2019-12-05 Browse times：437second
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Equipment name: |
flange |
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Manufactor: |
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Model: |
20μm |
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Particular year: |
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Equipment status: |
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Titanium alloy flange refers to the parts mainly used in semiconductor manufacturing stage and assembled on the dicing saw.
Cutting silicon wafer requires a thin blade (cutting tool).
In order to process products with high yield, the blade must be thin (about 20 μ m thick), and the spindle supporting the flange and blade on the scriber is running at high speed. Therefore, the flange material should be light and high rigid titanium alloy.
In order to prevent the bad machining of chipping (Burr) and other scribers, there is a very high requirement for flange deviation accuracy.
正面
侧面
反面
Specifications:
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Deviation accuracy |
Below 4 m |
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Chamfering chamfer |
More than 80% |
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Body shape |
It can be processed with various blade shapes and spindle shapes. It can also be applied to equipment other than dicing machine (oblique or straight spindle shape). Even if there is no part drawing, as long as there is a sample or simple idea or specification, we will draw and make the finished product for delivery. |
