切割膜

Back Grinding Tape -P Series-
A back grinding tape (hereafter as BG tape) is used for protecting the circuit surface from scratches, chipping / crack and particle contamination, during the back-grinding　process. The functions of BG tapes are (1) protecting workpiece surface from contamination, (2) highly close contact to workpiece and (3) easiness of peeling, and higher technology to those functions is required with the developments of jumbo-sized and thinned wafer and high-bumped wafer. Elegrip BG tapes produced by DENKA do not require to rinse your workpiece after BG process due to excellent adhesive. We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature
Excellent contact to asperity of the circuit side
Effective control of particle
Good water-seepage control
Excellent grinding accuracy (TTV)
Easy peeling
Effective control on adhesive deterioration with time

＊The above data is just for representing value, and not guaranteed value.
＊Color : MW (Milky White), B (Llight Blue), T (Transparent)
＊Separator thickness is not included.

本公司代理日本DENKA Tape，DENKA Tape以前的名称为Toyo Tape.

DENKA Tape 包括四款膜：

1.BG Tape,研磨保护膜，其中分UV型和Non UV型。

2.Non UV Tape，切割膜，通常为蓝色或者白色膜。

3.UV Tape，切割膜，也可以用做研磨保护。

4.Peeling Tape，用于研磨后的揭膜。

应用领域：

1.半导体硅片研磨保护

2.半导体硅片切割工序

3.半导体后段基板/铜框架切割工序

4.陶瓷基板切割工序

5. LED基板切割工序

6.玻璃产品切割工序

特点：

1.作为DENKA指定的代理商，我们在苏州,深圳工厂备有充足的不同类型，不同尺寸的样品供我们的客户选择试验。

2.我们拥有专门的UV膜应用试验室，可根据客户实际产品来选择Tape，提供切割试验，最终评估我们的产品是否适合客户的应用。

3.我们公司本身接洽研磨切割代工业务，对于常用的膜都备有安全库存，对于我们的客户，可以提供紧急的调货支援。